Ka'idar taPCBA reflow solderingdabara ce ta hawa sama da aka saba amfani da ita don sayar da kayan aikin lantarki zuwa allunan da'ira (PCBs).

The reflow soldering ka'idar dogara ne a kan ka'idodin zafi conduction da narkewa na solder kayan.Da farko, solder manna ana amfani da solder manna a kan PCB solder.The solder manna ya ƙunshi wani karfe gami, yawanci hada da gubar, tin, da sauran ƙananan narkewa kamar karafa.

Sa'an nan, surface Dutsen components (SMD) ana sanya daidai a kan solder manna.Na gaba, PCB da aka gyara suna tare ta hanyar reflow tanda, inda zazzabi profile da ake sarrafa.Sake dawo da siyar yana buƙatar tsarin dumama da sanyaya cikin manyan matakai guda biyu. Matakin zafi: Zazzabi yana tashi a hankali, yana haifar da manna solder ya fara narkewa.Ƙarfe mai ƙarfe a cikin manna mai siyar yana narkewa kuma ya samar da yanayin ruwa.

A lokacin wannan tsari, zafin jiki dole ne ya kai matakin da ya dace don tabbatar da haɗin gwiwa na solder ya narke, amma bai yi girma ba don lalata sauran abubuwan da ke cikin tanda mai sake fitarwa ko PCB.Soldering Stage: Yayin da manna mai narke yana narkewa, kayan haɗin gwal suna kafa wutar lantarki. da kuma haɗin injiniya tsakaninPCB da aka gyara.Lokacin da solder gidajen abinci isa da dace zafin jiki, karfe ball barbashi a cikin solder manna fara samar da gwangwani balls.Cooling mataki: Zazzabi a cikin reflow tanda fara raguwa, sa solder manna da sauri sanyi da kuma ƙarfi, forming barga solder gidajen abinci.
Bayan da solder gidajen abinci da aka sanyaya, da solder manna da ƙarfi da tabbaci ya haɗu da PCB da aka gyara together.The key to reflow soldering shi ne don sarrafa zafin jiki profile a cikin reflow tanda don tabbatar da cikakken narkewa na solder manna, kuma ga solder gidajen abinci to. samar da ingantaccen haɗin gwiwa da ƙarfi tare da PCB da abubuwan haɗin gwiwa.

Bugu da ƙari, ingancin manna mai siyar kuma yana tasiri ingancin siyar, don haka zaɓin tsarin da ya dace na solder yana da mahimmanci.A taƙaice, ka'idar PCBA reflow sol.