• iphepha_ibhena

Iimveliso

I-Golder Finger PCBA INdibano yeBhodi yeSekethe eprintiweyo

Inkcazelo emfutshane:

Ukuveliswa kwebhodi ye-PCB yomnwe wegolide yinkqubo ephambili, kwaye inkqubo yokuvelisa eneenkcukacha inikwe ngezantsi: Ukulungiswa kwezinto: Khetha izinto eziphezulu ze-substrate, ezifana ne-FR-4 i-glass fiber material, ukuqinisekisa amandla ayo omatshini kunye ne-thermal conductivity.Ngexesha elifanayo, khetha izinto zetsimbi ezine-conductivity efanelekileyo yombane ukwenza iminwe yegolide.Uyilo kunye noyilo: uyilo lwebhodi yePCB kunye noyilo ngokweemfuno zabathengi.Qinisekisa ukuba ubume besekethe bunengqiqo, indlela yomqondiso igudileyo, kwaye ushiye indawo yokuyila inxalenye yegolide yomnwe.


Iinkcukacha zeMveliso

Iithegi zeMveliso

Ukuthembeka okuphezulu

Ifotoplate: Ukusebenzisa itekhnoloji yefotoplate ukuhambisa iipatheni zesekethe kwi-substrate.Izinto zobhedu ezigqithisileyo zisuswa yifotomask kunye nekhemikhali etching ukwenza ipateni yesekethe efunwayo.Unyango olufakwe ngegolide: Unyango olufakwe ngegolide lwenziwa kwinxalenye yomnwe wegolide ukuze kuphuculwe ukuhanjiswa kombane kunye nokuxhathisa ukubola.Ngokuqhelekileyo, indlela ye-electroplating isetyenziselwa ukufaka ngokufanayo izinto zetsimbi kumphezulu womnwe wegolide.I-Welding kunye nendibano: Weld kwaye uhlanganise amacandelo kunye nebhodi ye-PCB ukuqinisekisa ukuba i-solder joints iqinile kwaye ithembekile.Sebenzisa iteknoloji yokunyuswa komhlaba (SMT) okanye i-plug-in soldering technology, khetha ngokweemfuno ezithile.Ukuhlolwa komgangatho kunye novavanyo: Ukuhlolwa komgangatho ongqongqo kunye novavanyo lwenziwa ngexesha lenkqubo yokuvelisa ukuqinisekisa ukuba ibhodi yePCB yomnwe wegolide ihlangabezana neenkcukacha kunye neemfuno zomgangatho.

svsdv (2)
svsdv (3)

bhetyebhetye Customization

Kubandakanya ukuhlolwa okubonakalayo, uvavanyo lweempawu zombane, uvavanyo lwe-impedance yoqhagamshelwano, njl. Ukucocwa kunye nokugquma: Coca i-PCB ye-Goldfinger egqityiweyo ukususa ukungcola komhlaba kunye neentsalela.Unyango lwe-anti-corrosion coating lwenziwa njengoko lufunekayo ukuphucula ukuxhathisa ukubola kwebhodi ye-PCB.Ukupakishwa kunye nokuhanjiswa: Ukupakisha ngokufanelekileyo i-PCB ye-Golden Finger egqityiweyo ukunqanda umonakalo womzimba okanye ungcoliseko.Emva kokugqiba uhlolo lokugqibela, hambisa kumthengi ngexesha.Inkqubo yokuvelisa ibhodi ye-Goldfinger PCB ifuna ukuchaneka okuphezulu kunye nolawulo olungqongqo lokuqinisekisa umgangatho wemveliso kunye nokuzinza.Siya kusebenza ngokungqongqo ngokungqinelana nale nkqubo ingentla ukuze sikubonelele ngeemveliso zebhodi zebhodi yegolide yomnwe wePCB.


  • Ngaphambili:
  • Okulandelayo: