KweI-SMTInqubo yokuhlanganisa intaba, izinto ezisele zikhiqizwa ngesikhathiUkuhlanganiswa kwe-PCBi-soldering ebangelwa i-flux ne-solder paste, ehlanganisa izingxenye ezihlukahlukene: izinto eziphilayo kanye nama-ion abolayo.Izinto ze-organic zigqwala kakhulu, futhi ama-ion asele kuma-solder pads angabangela amaphutha e-short-circuit.Ukwengeza, izinto eziningi ezisele ku-PCBAamabhodi angcolile futhi awahlangabezani nezidingo zokuhlanzeka komsebenzisi wokugcina.Ngakho-ke, akunakugwenywa ukuhlanza i-PCBAibhodi.Nokho,PCBA amabhodiakufanele ihlanzwe ngokunganaki, futhi izidingo eziqinile kanye nezinyathelo zokuphepha kufanele zilandelwe lapho kusetshenziswa aPCBAumshini wokuhlanza.
Nansi incazelo eningiliziwe yezinkinga ezithile ezivamile ngesikhathi somcimbiIbhodi le-PCBAinqubo yokuhlanza:
Okokuqala, emva komhlangano kanye ne-soldering of theibhodi lesifunda eliphrintiwe izingxenye, ukuhlanza kufanele kwenziwe ngokushesha ngangokunokwenzeka ukuze kususwe ngokuphelele ukugeleza okusele, i-solder, nokunye ukungcola ebhodini lesifunda eliphrintiwe (ngoba ukugeleza okusele kuzoqina kancane kancane ngokuhamba kwesikhathi, kwenze izinto ezigqwalisayo ezifana nosawoti we-metal halide).Ngakolunye uhlangothi, ngesikhathi sokuhlanza, kubalulekile ukugwema ama-agent okuhlanza ayingozi ukuthi angangeni ezingxenyeni ze-elekthronikhi ezingavalwanga ngokuphelele ukuvimbela ukulimala noma ukulimala okucashile ezingxenyeni.
Ngemuva kokuhlanza izingxenye zebhodi lesifunda eziphrintiwe, kufanele zifakwe kuhhavini ku-40 ~ 50 ° C futhi zibhakwe imizuzu engu-20 ~ 30, futhi izingxenye akufanele zithintwe ngezandla ezingenalutho ngaphambi kokuba zome ngokuphelele.Ngaphezu kwalokho, inqubo yokuhlanza akufanele ithinteizingxenye ze-elekthronikhi, izimpawu, amalunga e-solder, nebhodi lesifunda elinyathelisiwe
Isikhathi sokuthumela: Jan-22-2024