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Iphakheji ye-vacuum ye-PCB
I-PCB vacuum packaging ukufaka ibhodi lesifunda eliphrintiwe (PCB) esikhwameni sokupakisha se-vacuum, sebenzisa iphampu ye-vacuum ukukhipha umoya esikhwameni, ukunciphisa ingcindezi esikhwameni ibe ngaphansi komfutho womoya, bese uvala isikhwama sokupakisha ukuze uqinisekise. ukuthi i-PCB ayiwona umonakalo...Funda kabanzi -
PCB FR4 impahla
Izinto ze-PCB FR4 zitholakala ngezinhlobo ze-TG emaphakathi (izinga lokushisa lengilazi elimaphakathi) kanye nezinhlobo ze-TG ephezulu (izinga lokushisa lokushintsha kwengilazi ephezulu).I-TG isho izinga lokushisa lokushintsha kwengilazi, okungukuthi, kulokhu kushisa, ishidi le-FR4 lizodlula ...Funda kabanzi -
I-OEM+ODM SERVICE
INKONZO ye-OEM+ODM Sihlinzeka ngezinsizakalo ze-OEM+ODM zemikhiqizo yesikrini se-LCD eklanywe isofthiwe yethu yobungcweti nonjiniyela bezingxenyekazi zekhompuyutha.Sekuyiminyaka engama-20 sisebenza ngokukhethekile ekunikezeni izinsizakalo ze-PCBA zokuma okukodwa kwemikhakha yezokwelapha, yezimoto, neyezimboni.Ifektri yethu ...Funda kabanzi -
Ukuhlolwa kwe-Flying Probe mayelana ne-PCB
Eminyakeni embalwa edlule, ukuhlolwa kwenaliti endizayo sekuyiyona ndlela yokuhlola eya ngokuya idumile uma iqhathaniswa nokuhlolwa kwe-inthanethi kwe-PCBA okungokwesiko ngenxa yezidingo zedizayini eziqinile kanye nokuqedwa kwezindleko eziphezulu zokulungisa nezokuhlela.Ukuhlolwa kwenaliti endizayo kwenza...Funda kabanzi -
I-PCB etching iyindlela evamile yokukhiqiza amabhodi esekethe aphrintiwe (PCBS)
Okulandelayo izinyathelo ezijwayelekile zokushumeka kwe-PCB: Dizayina isakhiwo se-PCB futhi ukhiqize ifayela lesithombe elihambisanayo usebenzisa isofthiwe yokuklama ibhodi.Beka imaski ye-solder emincane ebhodini lesifunda ukuze uvikele ungqimba lwethusi olungadingi kuqoshwa.Isebenzisa i-photosen...Funda kabanzi -
PCB Test Point
Amaphuzu okuhlola e-PCB angamaphuzu akhethekile agcinwe ebhodini lesekethe ephrintiwe (PCB) ukuze kukale ugesi, ukudluliswa kwesignali nokuxilongwa kwephutha.Imisebenzi yabo ihlanganisa: Izilinganiso zikagesi: Amaphuzu okuhlola angasetshenziswa ukukala amapharamitha kagesi afana ne-voltage, i-current, ne-impedance ye...Funda kabanzi -
I-PCB icindezela izinyathelo zokuphepha
Udinga ukunaka lezi zindaba ezilandelayo lapho wenza i-PCB lamination: Ukulawula izinga lokushisa: Ukulawula izinga lokushisa ngesikhathi senqubo ye-lamination kubaluleke kakhulu.Qiniseka ukuthi izinga lokushisa aliphezulu kakhulu noma aliphansi kakhulu ukuze ugweme...Funda kabanzi -
Izinyathelo zokuphepha ze-PCBA reflux lokushisa
Izinga lokushisa lokugeleza kabusha libhekisela enkambisweni yokushisisa indawo yokunamathisela emazingeni okushisa athile ukuze kuncibilike unamathisele we-solder futhi uxhume izingxenye namaphedi ndawonye ngesikhathi senqubo yomhlangano webhodi lesifunda eliphrintiwe.Okulandelayo ukucatshangelwa kwe-reflow temperatur...Funda kabanzi -
I-PCBA IQC imele i-Printed Circuit Board Assembly Ukulawulwa Okungenayo Kwekhwalithi.
I-PCBA IQC imele i-Printed Circuit Board Assembly Ukulawulwa Okungenayo Kwekhwalithi.Isho inqubo yokuhlola nokuhlola izingxenye nezinto ezisetshenziswa ekuhlanganiseni amabhodi esekethe aphrintiwe.● Ukuhlola okubonakalayo: I-com...Funda kabanzi -
Inspection ye-athikili yokuqala ye-PCBA
Umhloli we-athikili yokuqala ye-PCBA iyithuluzi elisetshenziselwa ukuhlola i-PCBA (Printed Circuit Board Assembly).Isetshenziselwa ukuthola ukusebenza, ukusebenza kanye nekhwalithi ye-PCBA futhi iqinisekise ukuthi ihlangabezana nokucaciswa okuqondile kanye nezidingo.Umtshina wesihloko sokuqala we-PCBA ungenza...Funda kabanzi -
I-SPI solder paste detector yesivinini esikhulu umshini we-SMT ozenzakalelayo
I-SPI solder paste detector umshini we-SMT ozenzakalelayo ozenzakalelayo wesivinini esikhulu Umshini wokunamathisela othomathikhi onesivinini esiphezulu esifakwe umtshina wokunamathisela we-SPI we-solder uyisisetshenziswa esithuthukisiwe sokukhweza phezulu esingafeza ukusebenza kweziqephu ezinejubane eliphezulu, nokunemba okuphezulu futhi ifakwe i-SPI (i-Solde...Funda kabanzi -
Imishini Yokulungisa Kabusha ye-BGA
I-BGA professional rework machine iyisisetshenziswa esikhethekile esisetshenziselwa ukulungisa ama-chips e-BGA (ukupakishwa kwe-ball array).Ama-chips e-BGA awubuchwepheshe bokupakisha obunokuminyana okuphezulu obuvame ukusetshenziswa kumabhodi omama wezinto zikagesi.Ngenxa yobunzima bayo...Funda kabanzi